| 画像 | キーパーツ番号/メーカー | 説明/ PDF | 数量/ RFQ |
|---|---|---|---|
 |
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Grey |
18445個在庫 |
 |
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY. |
298個在庫 |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY. Thermal Interface Products Tflex 7190 9" x 9" |
303個在庫 |
 |
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Gold |
32699個在庫 |
 |
Bergquist |
THERM PAD 304.8MMX292.1MM W/ADH. Thermal Interface Products BERGQUIST SIL PAD TSP K1300 |
1446個在庫 |
 |
t-Global Technology |
THERM PAD 30MMX30MM RED. |
25412個在庫 |
 |
Wakefield-Vette |
THERM PAD 2.106 X 2.106. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 2.106 Inch x 2.106 Inch, No Hole |
55666個在庫 |
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold |
25276個在庫 |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY. |
313個在庫 |
 |
Bergquist |
THERM PAD 19.05MMX12.7MM BEIGE. Thermal Interface Products The High Performance Polyimide-Based Insulator, 0.006" Thickness, 19.05x12.7x4.75x3.73mm, Sil-Pad TSP K1300 Series / Also Known as Bergquist Sil-Pad K-10 Series |
190859個在庫 |
 |
3M (TC) |
THERM PAD 19.05MMX10.54MM. |
103911個在庫 |
|
Laird Technologies - Thermal Materials |
THERM PAD 228.6MMX228.6MM GRAY. Thermal Interface Products Tflex 7180 9" x 9" |
319個在庫 |
|
Laird Technologies - Thermal Materials |
THERM PAD 457.2MMX457.2MM BLUE. Thermal Interface Products Tflex 590 18x18" 2.8W/mK gap filler |
320個在庫 |
 |
t-Global Technology |
THERM PAD 12.5MMX12.5MM YELLOW. |
311736個在庫 |
 |
Wakefield-Vette |
THERM PAD TO-218 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-218 Pad with Hole |
190859個在庫 |
|
Wakefield-Vette |
THERM PAD 1.516 X 1.516. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.516 Inch x 1.516 Inch, No Hole |
87402個在庫 |
 |
3M (TC) |
THERM PAD 4.57MX19.05MM W/ADH. |
2314個在庫 |
 |
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 25.4x25.4mm, Green |
34131個在庫 |
|
Wakefield-Vette |
THERM PAD 101.6MMX101.6MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Green |
16790個在庫 |
 |
3M (TC) |
THERM PAD 21.84MMX18.79MM GRAY. |
97417個在庫 |
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